GlobalFoundries Announces Production Readiness of SLATE Wafer-to-Wafer Bonding Technology

GlobalFoundries (GFS) announced the production readiness of its SLATE wafer-to-wafer bonding technology on its 9SW radio-frequency silicon-on-insulator platform. The company plans to ramp up volume production by mid-2027, with this 3D integration solution expected to reduce die size for RF components in mobile devices.

By Maham Fatima Sun, July 12, 2026 at 7:32 PM GMT+3 2 min read · Yahoo Finance · July 12, 2026, 16:32 UTC

Tickers: $GFS

Topics: 3D integration 5G technology chip design wafer bonding

Read the full article at Yahoo Finance

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