Nexstrom Aims to Bring 2D Semiconductors to Chip Manufacturing
Singapore-based semiconductor startup Nexstrom is developing equipment and processes for manufacturing two-dimensional (2D) semiconductors, specifically transition-metal dichalcogenides (TMDs), on standard chip wafers. The company aims to address the limitations of shrinking silicon transistors by leveraging ultra-thin TMD materials that could reduce leakage, power loss, and heat in chips. Nexstrom's North Star product is designed for 300mm wafer production used in commercial semiconductor manufacturing. The startup recently raised $12 million in a seed round from investors including Xora Innovation, Foothill Ventures, and SEEDS, bringing its total funding to $15 million. Rather than competing with major chipmakers like TSMC or Intel, Nexstrom plans to collaborate with them by providing scalable 2D semiconductor production technology. The company is currently working on scaling up from smaller wafers toward full-size commercial production. Nexstrom's co-founder and chief scientist Lance Li has been researching post-silicon electronics since 2012. CEO Phoebe Tan stated that the startup expects its equipment to be ready for commercial use between 2030 and 2035, with current efforts focused on improving material quality and process control.
Topics: 2D materials chip manufacturing innovation startup development