ASML and Major Chipmakers Collaborate on Larger AI Chip Production
On September 8, 2026, Reuters reported that ASML Holding N.V. (NASDAQ:ASML) is collaborating with major chip manufacturers like TSMC (NYSE:TSM), Nvidia, Intel, Samsung, and SK Hynix to adapt its next-generation High NA extreme ultraviolet lithography tools for larger data-center chips. The current limitation of these machines lies in their use of smaller masks compared to ASML's standard EUV systems. By 2031, the company aims to establish a pilot production line using larger masks and achieve high-volume manufacturing readiness by 2033. ASML’s chief technology officer estimates that this change could boost system productivity by approximately 40%. The initiative is expected to create new growth opportunities for ASML while enabling TSMC to produce AI chips more efficiently. TSMC plans to integrate High NA EUV into its advanced-node production from 2030, aligning with ASML’s roadmap and potentially increasing equipment demand visibility. However, the benefits of this collaboration are not expected in the near term; both companies face execution risks such as technical delays or adoption costs. The transition requires more than just lithography tools—new mask infrastructure and production processes will also be necessary.
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Topics: AI chips ASML EUV lithography High NA EUV tools TSMC