Intel and ASML Advance High-NA EUV Lithography in Production
Intel (INTC) and ASML Holding N.V. (ASML) have confirmed that their collaboration on high-numerical aperture extreme ultraviolet lithography is progressing into commercial production, with over one million wafers processed using the technology across various stages of development and volume manufacturing for Intel’s Panther Lake processors. The companies highlighted successful performance results from High-NA EUV layers in select chips, validating its readiness. ASML plans to introduce larger-format masks by 2031 to support next-generation chip production, including large data center designs. Analysts remain cautiously optimistic about broader adoption but note that demand will depend on cost efficiency and execution. Despite manufacturing progress, Intel’s foundry business continues to face profitability challenges, with a $2.1 billion operating loss in Q2 2026 despite revenue growth.
Topics: ASML technology advancements High-NA EUV lithography Intel production updates