ASML and TSMC Collaborate for a 40% Productivity Boost with High-NA EUV Technology by 2033
ASML Holding N.V. (NASDAQ: ASML) and Taiwan Semiconductor Manufacturing Company Limited (NYSE: TSM) have announced plans to collaborate on improving chip production economics through the adoption of larger-format Extreme Ultraviolet (EUV) lithography photomasks. The transition from current 6-inch masks to new 12-inch masks is expected to increase fab productivity by up to 40%, reduce manufacturing costs, and eliminate stitching constraints in advanced node fabrication. ASML's chief technology officer, Marco Pieters, stated that the initiative could enhance scanner efficiency for its newest lithography platform. TSMC plans to begin using High-NA EUV machines at advanced nodes starting in 2030, with a full transition expected by 2031 and production readiness set for 2033. While this collaboration offers long-term benefits such as improved return on investment for both companies, the delayed timeline means it will not serve as an immediate earnings driver. Hedge fund ownership of ASML and TSMC remains strong, with increased holdings reported in Q2 compared to previous quarters.
Topics: ASML chip manufacturing EUV lithography High-NA technology TSMC