TSMC to Adopt ASML’s High-NA Technology by 2030, Outlining Two-Tiered Implementation Timeline
ASML (NASDAQ:ASML) and TSMC (NYSE:TSM) have outlined a roadmap for the adoption of ASML's next-generation High-NA extreme ultraviolet lithography technology. According to their September 8 announcement, TSMC plans to begin using this advanced manufacturing tool in high-volume production by 2030, with further expansion planned through 2031 and 2033 involving larger photomask sizes. The roadmap provides visibility for ASML's long-term demand but does not include specific order values or shipment schedules. For TSMC, the challenge lies in converting this new technology into economically viable chip production that supports customer demand while delivering acceptable returns on capital investment. The transition to twelve-inch masks is expected to improve productivity and reduce costs. While both companies benefit from the shared roadmap, their financial exposure differs due to timing of revenue recognition—ASML benefits earlier with equipment sales, whereas TSMC must wait for manufacturing results.
Topics: ASML High-NA EUV technology manufacturing roadmap TSMC