Fabric.AI and Kopin Publish White Paper on MicroLED Optical Interconnects for Next-Gen AI Data Centers
Fabric.AI Inc. (FABC) and Kopin Corporation (KOPN) have published a joint white paper titled 'Optical Interconnects as a Critical Enabler for Next-Generation AI Infrastructure.' The document explores how data movement, rather than compute power, is becoming the primary constraint in AI infrastructure scaling. The companies highlight their Neural I/o™ platform based on MicroLED optical interconnect technology. This approach enables sub-picojoule-per-bit efficiency and offers a scalable solution as traditional copper and laser-based optics reach physical limits. The white paper outlines how MicroLED arrays can scale bandwidth by increasing the number of emitters without requiring changes to cabling or topology. The collaboration aims to address growing energy, power, and cooling demands in AI data centers while enabling aggregate link speeds exceeding 20 Tb/s.
Tickers: $KOPN
Topics: AI infrastructure data centers energy efficiency MicroLED optical interconnects