GlobalFoundries Signs $300M R&D Agreement with US Department of Commerce for Silicon Photonics
The U.S. Department of Commerce (DOC) has signed a letter of intent (LOI) with GlobalFoundries to provide up to $300 million in funding under the CHIPS and Science Act’s research initiatives. The funds will support R&D efforts focused on silicon photonics, including optical materials, wafer technologies, and advanced packaging techniques such as 3D hybrid bonding. The investment aims to accelerate next-generation data center infrastructure for AI and high-performance computing by advancing near-packaged and co-packaged optics using GlobalFoundries' Silicon Photonics Co-Packaged Advanced Light Engine (SCALE) platform. The company claims the technology offers a fivefold improvement in energy efficiency compared to current solutions. As part of the agreement, the DOC will receive equity representing approximately 1% ownership of GlobalFoundries as of July 30, 2026.
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Topics: AI infrastructure CHIPS Act government funding semiconductors silicon photonics