Micromem Technologies Announces C$250,000 Private Placement Offering
Micromem Technologies (MRM) has announced a non-brokered private placement offering to raise up to C$250,000. The company maintains the discretion to increase the total offering amount by up to 50%. Each unit in the offering consists of one common share and one warrant, with the warrants exercisable at C$0.05 per share for a three-year term. The capital raised from this placement is earmarked for working capital requirements and the settlement of existing debt. This move aims to strengthen the company's balance sheet and provide necessary liquidity for ongoing operations.
Topics: capital raising debt settlement private placement working capital