TSMC and Samsung Commit to ASML's High NA EUV Machines for Advanced Chip Production
Leading chipmakers TSMC and Samsung have committed to using ASML’s next-generation High Numerical Aperture (High NA) extreme ultraviolet lithography machines as demand grows for advanced chips driven by artificial intelligence. These tools, which can print smaller and more intricate circuit patterns on silicon wafers, are expected to be critical in advancing chip manufacturing capabilities. Samsung plans to use the technology starting in 2028 for DRAM memory production, while TSMC expects adoption around 2030 for advanced chips. The machines cost approximately $400 million each and represent a significant investment that investors view as key to ASML’s future growth trajectory. The announcements provide clarity on the technology's adoption path, which analysts say is important given strong demand signals from major chipmakers like Intel, Samsung, and TSMC.
Tickers: $ASML
Topics: AI chips ASML High NA EUV lithography Samsung TSMC