Samsung Electronics partners with Broadcom for AI chip manufacturing worth over $200 billion until 2030
Samsung Electronics has entered into a long-term partnership with U.S.-based chip designer Broadcom to expand collaboration in memory chips, contract chip making, and advanced packaging. The deal is expected to exceed $200 billion by 2030. This agreement includes production of next-generation communications chips using Samsung's sub-2-nanometre process technology as well as joint development on high-bandwidth memory (HBM) products. The partnership aims to strengthen Samsung’s foundry business and help it close the gap with industry leader TSMC by securing major tech clients. The collaboration aligns with growing demand for custom AI accelerators, where companies are increasingly designing their own specialized chips rather than relying on general-purpose processors.
Topics: AI chips Broadcom partnership foundry business semiconductors