Samsung Signs Over $200 Billion Chip Supply Deal with Broadcom
Samsung Electronics has signed a memorandum of understanding (MOU) to supply chips worth over $200 billion to Broadcom through 2030. The agreement includes supplying memory and foundry chips, particularly high-bandwidth memory (HBM), which will be used in Broadcom’s next-generation AI products. This long-term partnership underscores the growing demand for advanced semiconductor solutions driven by artificial intelligence development. Samsung's role as a key supplier highlights its position in the global chip manufacturing industry while also strengthening Broadcom’s supply chain security and production capabilities.
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Topics: AI chips foundry services memory technology semiconductors