Nvidia and Amkor Sign $1.5 Billion Chip Packaging Agreement
Nvidia has entered a multi-year agreement with Amkor Technology worth $1.5 billion to expand advanced semiconductor packaging and testing capabilities in the U.S., particularly focusing on AI infrastructure development. The partnership includes prepayments from Nvidia to support capacity expansion, including operations in Arizona. The two companies will jointly develop new packaging technologies for Nvidia's AI platforms that integrate multiple chips into a single package. Amkor already supplies packaging services for Nvidia’s data center processors and aims to bring innovative solutions to market as demand grows. Amkor recently partnered with TSMC on a 10-year agreement to enhance U.S.-based semiconductor packaging capabilities, and it also collaborates with AMD in chip packaging.
Topics: AI infrastructure Amkor Technology Nvidia packaging technology semiconductors