Besi Reports More Than Double Quarterly Orders Driven by AI and Hybrid Bonding Technology

BESI reported a significant increase in quarterly orders, driven by strong demand for hybrid bonding technology used in AI applications. The Dutch semiconductor equipment maker saw order bookings rise to €292.9 million in Q2 2026 from €128 million the previous year.

By Reuters Thu, July 23, 2026 at 8:15 AM GMT+3 1 min read · Yahoo Finance · July 23, 2026, 05:15 UTC

Topics: AI Data Centers Hybrid Bonding Technology Photonics

Read the full article at Yahoo Finance

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