SK Hynix Files $28 Billion U.S. IPO Filing
SK Hynix is preparing a $28 billion initial public offering (IPO) in the United States, aiming to raise capital for expansion and advanced manufacturing capabilities. The company plans to use proceeds from its Nasdaq listing on July 10, 2026, primarily for capex projects including production capacity upgrades and EUV lithography acquisitions.
Topics: capital expenditures HBM demand IPO memory chips SK Hynix