AMD Announces $10 Billion Investment in Taiwan's AI Infrastructure

Advanced Micro Devices (NASDAQ:AMD) announced a strategic investment of over $10 billion across the Taiwan ecosystem to scale advanced packaging manufacturing for next-generation AI infrastructure. The initiative includes collaborations with partners like ASE and SPIL on wafer-based interconnect technology, supporting AMD’s Helios rack-scale platform powered by MI450X GPUs and 6th Gen EPYC CPUs.

By Maham Fatima Sun, May 24, 2026 at 12:13 AM GMT+3 2 min read · Yahoo Finance · May 23, 2026, 21:13 UTC

Tickers: $AMD $SANM

Topics: Advanced Packaging Technology AI Infrastructure Semiconductors

Read the full article at Yahoo Finance

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